Ukukhuselwa kokusingqongileyo kuhlawulwa ngakumbi nangakumbi, ngakumbi ngokunyuka kwemozulu yenkungu. Ubunjineli begumbi elicocekileyo lelinye lamanyathelo okukhusela okusingqongileyo. Usebenzisa njani ubunjineli begumbi elicocekileyo ukwenza umsebenzi olungileyo ekukhuselweni kwendalo? Makhe sithethe ngolawulo kubunjineli begumbi elicocekileyo.
Ulawulo lobushushu kunye nokufuma kwigumbi elicocekileyo
Iqondo lokushisa kunye nomswakama weendawo ezicocekileyo zinqunywe ngokukodwa ngokusekelwe kwiimfuno zenkqubo, kodwa xa udibana neemfuno zenkqubo, induduzo yomntu kufuneka ithathelwe ingqalelo. Ngokuphuculwa kweemfuno zococeko lomoya, kukho umkhwa weemfuno ezingqongqo zobushushu kunye nokufuma kwinkqubo.
Njengomgaqo jikelele, ngenxa yokuchaneka okunyukayo kokulungiswa, iimfuno zoluhlu lokuguquguquka kweqondo lokushisa ziba zincinci kwaye zincinci. Umzekelo, kwi-lithography kunye nenkqubo yokuvezwa kwemveliso yesekethe enkulu edibeneyo, umahluko kwi-coefficient yokwandisa i-thermal phakathi kweglasi kunye ne-silicon wafers ezisetyenziswa njengezixhobo zemaski iya isiba ncinci.
I-silicon wafer enobubanzi be-100 μ m ibangela ukwandiswa komgca we-0.24 μ m xa ubushushu bukhuphuka nge-1 degree. Ke ngoko, ubushushu obungaguqukiyo be-± 0.1 ℃ buyimfuneko, kwaye ixabiso lokufuma liphantsi ngokubanzi kuba emva kokubila, imveliso iya kungcoliswa, ngakumbi kwiindibano zocweyo zesemiconductor ezoyika isodium. Olu hlobo locweyo akufunekanga ludlule kwi-25℃.
Ukufuma okugqithisileyo kubangela iingxaki ezingakumbi. Xa ukufuma okunxulumeneyo kudlula i-55%, ukujiya kuya kwenziwa kudonga lombhobho wamanzi okupholisa. Ukuba kwenzeka kwizixhobo ezichanekileyo okanye kwiisekethe, kunokubangela iingozi ezahlukeneyo. Xa ukufuma okumalunga nama-50%, kulula ukurusa. Ukongeza, xa ukufuma kuphezulu kakhulu, uthuli olunamathele kumphezulu we-silicon wafer luya kubhengezwa ngokwekhemikhali kumphezulu ngokusebenzisa iimolekyuli zamanzi ezisemoyeni, ekunzima ukuzisusa.
Ukuphakama komswakama ohambelanayo, kunzima kakhulu ukususa ukunamathela. Nangona kunjalo, xa ukufuma okunxulumeneyo kungaphantsi kwe-30%, amasuntswana nawo abhengezwa ngokulula kumphezulu ngenxa yesenzo samandla ombane we-electrostatic, kwaye inani elikhulu lezixhobo ze-semiconductor zithande ukophuka. Olona luhlu lufanelekileyo lobushushu bokuvelisa i-silicon wafer yi-35-45%.
Uxinzelelo lomoyaulawulokwigumbi elicocekileyo
Kwiindawo ezininzi ezicocekileyo, ukwenzela ukukhusela ukungcola kwangaphandle ekuhlaselweni, kuyimfuneko ukugcina uxinzelelo lwangaphakathi (uxinzelelo lwe-static) oluphezulu kunoxinzelelo lwangaphandle (uxinzelelo lwe-static). Ukugcinwa komehluko woxinzelelo kufuneka ngokubanzi kuhambelane nale migaqo ilandelayo:
1. Uxinzelelo kwiindawo ezicocekileyo kufuneka lube phezulu kunolo lweendawo ezingacocekanga.
2. Uxinzelelo kwiindawo ezinamazinga aphezulu okucoceka kufuneka abe phezulu kuneendawo ezikufutshane kunye namanqanaba aphantsi okucoceka.
3. Iingcango phakathi kwamagumbi acocekileyo kufuneka zivulwe ngamagumbi anamanqanaba aphezulu ococeko.
Ukugcinwa komehluko woxinzelelo kuxhomekeke kwisixa somoya omtsha, omele ukwazi ukuhlawulela ukuvuza komoya kwi-gap phantsi kwalo mahluko woxinzelelo. Ke intsingiselo yomzimba yokwahlukana koxinzelelo kukumelana nokuvuza (okanye ukungena) ukuhamba komoya kwizikhewu ezahlukeneyo kwigumbi elicocekileyo.
Ixesha lokuposa: Jul-21-2023